Japan-based printing technology company Toppan has broken ground for a semiconductor packaging materials facility in Jurong, Singapore.
The facility is scheduled to commence operations in 2026, creating 350 new jobs. This marks the first establishment of its kind in Singapore and represents Toppan’s inaugural investment outside of Japan.
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The 95000 m2 factory will produce FC-BGA (Flip Chip Ball Grid Array) substrates, with the company aiming to enhance production by more than 2.5 times compared to FY2022 by FY2027. Although the investment amount was not disclosed by Toppan, the Japanese newspaper Nikkei reported the estimated figure as $338m (JPY50bn).
During the groundbreaking ceremony held on March 14, Tetsuro Ueki, the head of Electronics Division at Toppan, commented: “Singapore was the most attractive destination for this investment as it is where most of our top clients and partners are located. We also wanted a production line outside Japan for business continuity purposes and found Singapore as the most appropriate location.”
The facility receives support from JTC, Singapore’s primary developer and manager of industrial estates, and the Singapore Economic Development Board (EDB), which facilitates the acquisition of resources such as land, electricity, and water. Additionally, the facility benefits from the backing of Toppan’s major client for FC-BGA substrates, the global technology giant Broadcom
